新葡萄京娱乐场

穆德魁

2018-07-20

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个人简介:

穆德魁,博士,副教授,硕士生导师。2012年毕业于昆士兰大学获材料科学与工程博士学位,目前主要从事超硬材料的焊接机理及在工具制备领域的应用研究。

 

研究方向:

超硬材料焊接、电子封装、脆硬材料晶体结构与力学性能

 

研究领域:

钎焊

 

学习工作经历:

 学习经历:

1997-2001: 北京航空航天大学,机电一体化专业,本科。

2004-2008: 昆士兰科技大学 (Queensland University of Technology, Australia), 机械工程(Mechanical Engineering),学士(Bachelor),硕士 (M. Phil.)

2009-2012: 昆士兰大学 (The University of Queensland, Australia), 材料科学与工程 (Material Science and Engineering), 博士(2011年3月至2011年4月:交换学生,大阪大学(Osaka University, Osaka, Japan)。

 

 工作经历:

2012年11月-2013年7月: 博士后研究员,昆士兰大学 (The University of Queensland, Brisbane, Australia)

2013年8月至2014年6月: 研发工程师,斯培利亚 (Nihon Superior Co.,Ltd,Osaka,Japan)

2014年9月至2015年8月: 讲师,江苏科技大学

2015年9月至今: 副教授,华侨大学

 

主持或参与的科研项目:

国家自然科学基金面上项目:活性软钎料低温连接金刚石磨粒关键技术的基础研究(2-17-2021),主持。

福建省科技厅引导性项目:钎焊金刚石用异质增强低温焊料的开发研究 (2018-2021),主持。

厦门市科技局产学研协同创新项目:钎焊微粉金刚石砂轮制备工艺(2018-2022)。主持。

华侨大学中青年教师科技创新资助计划(优秀青年科技创新人才)(2018-2022),主持。

 


主要论著与学术论文:

1.Yubin, Zhang, Xinjiang Liao, Qiaoli Lin, Dekui Mu*, Jing Lu, Hui Huang, Han Huang: Reactive Infiltration and Microstructural Characteristics of Sn-V Active Solder Alloys on Porous Graphite, Materials 13(7):1532.
2.Xinjiang Liao, Qiqi He, Qiaoli Lin, Dekui Mu*, Reactive wetting of Sn-V solder alloys on polycrystalline CVD diamond, Applied Surface Science 504 (2020) 144508.
3.D. Mu*, K.Y. Feng, Q.L. Lin, H. Huang, Low-temperature wetting of sapphire using Sn–Ti active solder alloys, Ceramics International, 45 (2019) 22175–22182.
4.X.J. Liao, D. Mu*, W. Fu, H. Huang, H. Huang: Low-temperature wetting mechanisms of polycrystalline chemical vapour deposition (CVD) diamond by Sn-Ti solder alloys, Materials & Design, 182 (2019) 108039.
5.J. Shen, L. Li, X. Wu, H. Chen, W.Z. Huang, D. Mu: Interfacial characteristics of titanium coated micro-powder diamond abrasive tools fabricated by electroforming-brazing composite process, International Journal of Refractory Metals and Hard Materials, 84 (2019) 104973.
6.M Li, J Chen, Q Lin, Y Wu, D Mu*: Interfacial microstructures and mechanical integrity of synthetic diamond brazed by a low-temperature Cu-Sn-Cr filler alloy, Diamond and Related Materials, 97 (2019) 107440.
7.J. Chen, X. Liao, Q. Lin, D. Mu*, H. Huang, X. Xu. H. Huang: Reactive wetting of binary Sn Cr alloy on polycrystalline chemical vapour deposited diamond at relatively low temperatures, Diamond and Related Materials, 92 (2019) 92-99.
8.J. Chen, D. Mu*, X. Liao, G. Huang, H. Huang, X. Xu, H. Huang, Interfacial microstructure and mechanical properties of synthetic diamond brazed by Ni-Cr-P filler alloy. International Journal of Refractory Metals and Hard Materials, 74 (2018) 52-60.
9.X. Liao, D. Mu*, J. Wang, G. Huang, H. Huang, X. Xu, H. Huang, Formation of TiC via interface reaction between diamond grits and Sn-Ti alloys at relatively low temperatures, International. Journal of Refractory Metals & Hard Materials, 66 (2017) 252-257.
10.D.Mu, S.D. McDonald, J. Read, H. Huang and K. Nogta: Critical Properties of Cu6Sn5 in Electronic Devices: Recent Progress and A Review. Current Opinion in Solid State & Materials Science. 20,55-76 (2016).
11.G. Zeng, S.D. McDonald, D. Mu, K.Nogita, Y. Terada, H. Yasuda, Q.F. Gu, K, Nogita: Ni segregation in the interfacial (Cu, Ni)6Sn5 intermetallic layer of Sn-0.7 Cu-0.05 Ni/Cu ball grid array (BGA) joints. Intermetallics, 54, 21-27 (2014).
12.Y. F. Yang, D. Mu, Q.C. Jiang: A simple route to fabricate TiC-TiB2/Ni composite via thermal explosion reaction assisted with external pressure in air. Materials Chemistry and Physics,143, 480-485 (2014).
13.Y. F. Yang, D. Mu: Simultaneous dehydrogenation and synthesis of TiB2-TiC through self-propagation high-temperature synthesis from TiH2-B4C powder blends. Metallurgical and Materials Transactions A, 34 (2014) 3184-3188.
14.Y. F. Yang, D. Mu: Effects of Ni additions on the formation of Ti5Si3 prepared by self-propagation high-temperature synthesis. Journal of the European Ceramic Society, 34, 2177-2185 (2014).
15.D. Mu, H. Huang, S. D. McDonald, J. Read and K. Nogita: Investigating the Mechanical Properties, Creep and Crack Pattern of Cu6Sn5 and (Cu,Ni)6Sn5 on Diverse Crystal Planes. Material Science and Engineering A, 566, 126 (2013).
16.D. Mu*, H. Huang, S. D. McDonald and K. Nogita: Creep and Mechanical Properties of Cu6Sn5 and (Cu,Ni)6Sn5 at Elevated Temperatures. Journal of Electronic Materials, 42, 304 (2013).
17.Y. F. Yang, D. Mu: Dehydrogenation process and its effect on formation mechanism of TiC during self-propagation high-temperature synthesis from TiH2-C. Powder Technology, 249 208-211 (2013).
18.D. Mu*, H. Yasuda, H. Huang and K. Nogita: Growth orientation and mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5 on poly-crystalline Cu. Journal of Alloys and Compounds, 536, 39 (2012).
19.D. Mu, H. Huang and K. Nogita: Anisotropic mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5. Materials Letters, 86, 46 (2012).
20.K. Nogita, D. Mu, S. D. McDonald, J. Read and Y.Q. Wu: Effect of Ni on phase stability and thermal expansion of Cu6-XNiXSn5. Intermetallics, 26, 78 (2012).
21.D. Mu*, J. Read, Y. F. Yang and K. Nogita: Thermal expansion of Cu6Sn5 and (Cu,Ni)6Sn5. Journal of Material Research, 26, 2660 (2011).
22.D. Mu*, H. Tsukamoto, H. Huang and K. Nogita: Formation and mechanical properties of intermetallic compounds in Sn-Cu high-temperature lead-free solder joints. Material Science Forum, Vol. 654, 2450 (2010).

 

 

联系方式:

联系电话:15759211638

电子邮箱:dekui.mu@hqu.edu.cn;  dekui.mu@uqconnect.edu.au

 

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